The High-Performance Materials Institute (HPMI) at FSU has a complete set of state-of-the-art processing, testing, characterization and computing facilities for materials, composites and nanocomposite research. Most equipment, valued at approximately $8,000,000 is housed in the 45,000 square foot Materials Research Building. HPMI has the resources multiple capabilities including:
Electrical Conductivity Measurements
Environmental Property Testing
Imaging and Microscopy
Materials, Composites and Nanocomposite Processing
Materials Synthesis
Mechanical Property Testing
Modeling and Simulation
Spectroscopy
Thermal Analysis
Complete Equipment Listing
- Chemical Vapor Deposition System, EasyTube 3000
- E-Beam evaporator, 6" Torvac and 6" Veeco dual system
- MTI GSL-1600X, High temperature vacuum tube furnace (1500°C, Φ50 mm×1000 mm)
- Specialty Coating Systems G3P-8 spin coater with hot-stage
- Sheet drawing apparatus
- Cole-Palmer vacuum ovens (~350°C)
- Ductless fume hood (Aura, particles larger than 0.3 microns), Misonix
- UV curing machine, 15"×15", FS600, Fusion UV
- GERBER conveyorized fiber cutter (GTxL Multi-Ply Cutter)
- Waterjet cutter, OMAX 55100/30
- Computer numerical control (CNC) machine, HAAS, VF2
- Autoclave, ASC, Econoclave EC3X6
- Additive manufacturing 3-D printer, Objet 30
- Integrated continuous buckypaper fabrication station
- Hot presses (6”x6”, 12”x12” and 24”x24”)
- Autoclave, ASC, Econoclave EC3X6
- Ovens (various)
- RIDFT machines (various sizes)
- RTM Machine, Liquid Control-Twinflow
- VARTM process setups
- Atomic force microscope (AFM), Veeco Instruments Inc., Multimode with nanoscope V
- High resolution Field Emission Scanning Electron Microscope (FESEM), JEOL 7401F
- Olympus BX40 with CCD camera (5X, 10X, & 50X lens)
- CytoVivaTM Microscopy
- Microimaging SV-11 Apo, CCD camera, stereo/optical combination microscope, Carl Zeiss
- High resolution sputter coater, Polaron, SC 7640
- High-resolution TEM system, JEOL (shared)
- 3D Digitizer/Scanner, Minolta Vivid 910
- Renishaw Confocal Research Raman Microscopy (upgraded InVia, 633 nm and 785 nm laser sources)
- SAXS/WAXS X-ray scattering, Bruker, Nanostar
- UV-Vis-NIR Spectrophotometer, Varian Cary 5000
- FT-IR with microscopy (4000-200 cm-1) Thermo Nicolet NEXUS 470
- Zeta Potential & Particle Size Analyzer, Beckman Coulter, Delsa Nano C
- Ultracentrifuge, Beckman Coulter, Optia Max XP
- Surface Area and Porosity Analyzer, Micrometrics Inc., Tristar
- Differential Scanning Calorimeter , DSC Q100, TA Instrument
- Thermomechanical Analyzer, TMA2940, TA Instrument
- Thermogravimetric Analyzer, TGA Q50, TA Instrument
- Dynamic Mechanical Analyzer, DMA2980, TA Instrument
- Dynamic Mechanical Analyzer, Q800, TA Instrument
- Rheometer, ARES-LS2, TA Instrument
- Laser flash thermal conductivity measurement system, Netzsch LFA 457 Microflash
- Integrated IR Camera-Analyzer, IR Instruments
- Four-probe, two-probe, and surface electrical resistivity measurement setups (four Keithley 2002 MEM multimeters and HP power supplies)
- Janis Research VPF-100 cryostat system
- MTS 585 test machine (25KN, hydraulic grips, laser strain gauge)
- MTS 858, table top system
- Micro test frame, Shimadzu AGS-J (500 N and 1 kN load cells)
- Video extensometer system, Shimadzu (DVE-201 video extensometer system and TH229 pneumatic grips, Accuracy: +/- 0.01 mm)
- Russells Temperature/humidity test chamber (GD–16–3–3, working space: 30"×30"×30", -68°C – 177°C)
- Thermal analysis software (ABAQUS, ANSYS, MARC)
- Molecular dynamics modeling of interfacial bonding and load transfer (Materials Studio (SGI Origin 300), LAMMPS (Teragold IBM p-Series 690))
- Modeling of conductive network-electrical property relationships for polymer/carbon nanotube composites
- Simulation software for composite materials processing (RTMSim, etc.)
